| Forming Electrically Conductive Interconnects between Nanowires Using Solder Reflow | ||
| Zhiyong Gu1, Hongke Ye1, Thomas Yu1, Adam Bernfeld1 and David H. Gracias2, (1)Department of Chemical and Biomolecular Engineering, Johns Hopkins University, 221 Maryland Hall, 3400 N. Charles Street, Baltimore, MD 21218, (2)Department of Chemical and Biomolecular Engineering, Johns Hopkins University, 125 Maryland Hall, 3400 N. Charles Street, Baltimore, MD 21218 In this paper we describe the utilization of solder reflow to form electrically conductive interconnects between nanowires-nanowires and nanowires-substrates. The nanowires that range in diameter from 30 nm to 200 nm are fabricated using electrodeposition in nanoporous templates. Reflowed solder joints are characterized using electron microscopy and electrical probe testing. We will describe the integration of nanowires to form elementary electrical devices such as an AC integrator. Extended Abstract Status: Not Uploaded | ||