| The Future of Smart Packaging and Rfid: The Path to Widespread Adoption (Panel Discussion) | ||
| Paul Rasband, Vue Technologies, 10894 Martingale, Frederick, MD 21701, Jeff Lindsay, Innovation Edge (www.innovationedge.com), 1526 South Commercial Street, Suite 200, Neenah, WI 54956, Gary F. Madsen, Auto-ID Sensing Technologies, Kimberly-Clark Corp., 2001 Marathon Ave., Neenah, WI 54956, Vivek Subramanian, Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA 94720-1770 and Paul D. Fleming III, Department of Paper Engineering, Chemical Engineering and Imaging, Western Michigan University, Kalamazoo, MI 49008 In spite of the many brilliant advances in RFID and smart packaging technology, there are challenges in identifying the proper business models to bring these technologies into widespread use. The five participants in this panel will share their insights into the future of these technologies and the pathway to adoption, and will answer questions from the audience. Extended Abstract Status: Not Uploaded | ||