3-D Electrically Interconnected Nanowire Networks Formed By Fluidic Diffusion Bonding
Zhiyong Gu1, Hongke Ye2, Adam Bernfeld2, Kenneth J. T. Livi3 and David H. Gracias4, (1)Department of Chemical Engineering, University of Massachusetts, One University Avenue, Lowell, MA 01854, (2)Department of Chemical and Biomolecular Engineering, Johns Hopkins University, 221 Maryland Hall, 3400 N. Charles Street, Baltimore, MD 21218, (3)Morton K. Blaustein Department of Earth & Planetary Sciences, Johns Hopkins University, OLIN HALL 129, 3400 N. Charles Street, Baltimore, MD 21218, (4)Department of Chemical and Biomolecular Engineering, Johns Hopkins University, 125 Maryland Hall, 3400 N Charles Street, Baltimore, MD 21218

We demonstrate a new strategy to bond and integrate nanowires (NWs) using fluidic interfacial diffusion bonding of gold (Au). The strategy was used to form very large scale, electrically interconnected three dimensional (3D) NW networks composed of both homogeneous and heterogeneous (multisegmented) NWs. The size of the networks ranged from tens micrometers to millimeters. We have measured the electrical characteristics of the networks and explored one application of the networks in 3D spatial chemical sensing.

Extended Abstract Status: Not Uploaded

Nanowires II: Modeling, Integration Strategies and Applications

The Preliminary Program for 2007 Annual Meeting