Preliminary Program subject to change
08E01 Plasma Processing
Overviewtba
Primary SponsorElectronics and Photonics (08e)

Chair

Vincent M. Donnelly
Chemical Engineering
University of Houston
4800 Calhoun Rd. Chem. Eng. Dept. S239
Houston, TX 77204
Phone Number: 713-743-4313
Email: vmdonnelly@uh.edu

CoChair

Sumit Agarwal
Assistant Professor
Chemical Engineering
Colorado School of Mines
443 Alderson Hall
Golden, CO 80401
Phone Number: 303-273-3508
Fax Number: 303-273-3730
Email: sagarwal@mines.edu
In Situ Measurement Of The Ion Incidence Angle Dependence Of The Ion-Enhanced Etching Yield In Plasma Reactors
Rodolfo Jun Belen, Applied Materials, Santa Clara, CA 95054, Sergi Gomez, Intel, Dublin, Ireland, Mark Kiehlbauch, Micron, Boise, ID 83706 and Eray S. Aydil, Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Avenue SE, Minneapolis, MN 55455
Prediction Of Feature Profile Evolution In Shallow Trench Isolation Etching
John Hoang1, Cheng-che Hsu2 and Jane P. Chang2, (1)Chemical and Biomolecular Engineering Department, UCLA, Los Angeles, CA 90095, (2)Department of Chemical and Biomolecular Engineering, University of California at Los Angeles, Los Angeles, CA 90095
The Effect Of Oxygen Addition In A Chlorine Plasma During Shallow Trench Isolation Etch
Cheng-che Hsu and Jane P. Chang, Department of Chemical and Biomolecular Engineering, University of California at Los Angeles, Los Angeles, CA 90095
The Effect Of Polymerizing Chemistry And Ion Flux On Oxide Fencing, Line Edge Roughness, And Micro-Trenching In Nano-Scale Interconnect Structures For 45 Node Reactive Ion Etching Process
Ammar Alkhawaldeh, R&D, Texas Instruments, Dallas, TX 75243
Reaction Mechanisms In Patterning Hafnium-Based Metal Oxide Thin Films
Ryan M. Martin, Chemical Engineering, UCLA, 5532-D Boelter Hall, 420 Westwood Plaza, Los Angeles, CA 90095, Hans-Olof Blom, Uppsala University, Uppsala, Sweden and Jane P. Chang, UCLA, 5532-D Boelter Hall, 420 Westwood Plaza, Los Angeles, CA 90095
Plasma Activation Of Polymer Surfaces For Enhanced Adhesion
Eleazar Gonzalez II1, Michael Barankin1, Andrew G. Hsieh1, Steve Babayan2, Robert F. Hicks1, Joseph Deitzel3 and John Gillespie Jr.3, (1)Chemical & Biomolecular Engineering, University of California, Los Angeles, Box 951592, Los Angeles, CA 90095-1592, (2)Surfx Technologies, LLC, 3617 Hayden Ave, Culver City, CA 90232, (3)University of Delaware, 150 Academy Street, Newark, DE 19711
Investigation Of Physical Vapor Deposited Ta / W Multilayer Structure As A Copper Diffusion Barrier
Prodyut Majumder, Department of Chemical Engineering, University of Illinois at Chicago, 810 S Clinton St, Chicago, IL 60607 and Christos G. Takoudis, Departments of Chemical Engineering and Bioengineering, University of Illinois at Chicago, 851 S. Morgan St, Chicago, IL 60607

Materials Engineering and Sciences Division