Wednesday, November 7, 2007 - 2:10 PM
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Unique Ag Nano Plate for Low Temperature Printed Circuit Production

Young Jin Kim1, Chang Gun Lee1, Won Hee Lee2, and Insoo Kim2. (1) New Product Development, Tokusen USA Inc., 1500 Amity Road, Conway, AR 72033, (2) Metallurgical Engineering, Dong A University, Hadan 2 Dong, Saha Gu, Busan, 604-714, South Korea

A unique Ag flake powder has been synthesized which has applications in the low temperature printed circuit production field due to its single crystal phase, high aspect ratio ( > 40), and low resistivity. Silver paste made with these particles exhibits superior conductivity when compared to conventional silver pastes. The increased conductivity will allow manufacturers to print more circuits with a given volume of paste and improve productivity.