Young Jin Kim1, Chang Gun Lee1, Won Hee Lee2, and Insoo Kim2. (1) New Product Development, Tokusen USA Inc., 1500 Amity Road, Conway, AR 72033, (2) Metallurgical Engineering, Dong A University, Hadan 2 Dong, Saha Gu, Busan, 604-714, South Korea
A unique Ag flake powder has been synthesized which has applications in the low temperature printed circuit production field due to its single crystal phase, high aspect ratio ( > 40), and low resistivity. Silver paste made with these particles exhibits superior conductivity when compared to conventional silver pastes. The increased conductivity will allow manufacturers to print more circuits with a given volume of paste and improve productivity.