Using Polymer Thin Films to Model Nanocomposites

Thursday, November 20, 2008: 3:15 PM
Room 103-C (Pennsylvania Convention Center)

Jintao Yang, Department of Chemical and Biomolecular Engineering, the Ohio State University, Columbus, OH
Bin Zhu, Department of Chemical and Biomolecular Engineering, the Ohio State University, Columbus, OH
Weibin Zha, Department of Chemical and Biomolecular Engineering, The Ohio State University, Columbus, OH
Hongmin Chen, Chemistry Dept., University of Missouri - Kansas City, Kansas City, MO
Y.C. Jean, Chemistry Dept., University of Missouri - Kansas City, Kansas City, MO
L. James Lee, Department of Chemical and Biomolecular Engineering, the Ohio State University, Columbus, OH

Polymer thin films spin-coated on certain substrates, such as oxide silicon wafer and HOPG, can be used as a one-dimensional model to investigate the interactions near the polymer-nanoparticle (e.g. montmorillonite (MMT) and carbon nanotubes) interface in nanocomposites. In this study, we used differential scanning calorimetry (DSC), AFM nanoindentation, gold nanoparticle embedding technology, positron annihilation lifetime (PAL) spectroscopy and ellipsometry to measure the average and local properties such as glass transition temperature (Tg), free volume and elastic modulus for polymer thin films with different thicknesses. Surface of silicon wafer and HOPG is acid treated and grafted with surfactants and block copolymers prepared by atom transfer radical polymerization (ATRP) as in nanocomposite synthesis. The difference in the interactions between polymer and modified substrate or unmodified substrate compared well with that observed in nanocomposites.
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See more of this Session: Polymer Thin Films and Interfaces IV
See more of this Group/Topical: Engineering Sciences and Fundamentals