This preliminary program is subject to change.

Plasma Science and Processing


Description:
This session focuses on plasma science and processing topics, including gas-phase diagnostics, plasma-surface interactions, and multiscale modeling.

Sponsor:
Electronics and Photonics


Chair:
Sang M. Han
Associate Professor
University of New Mexico
Department of Chemical & Nuclear Engineering
Albuquerque, NM 87131-1341
Phone Number: 505-277-3118
Fax Number: 505-277-5433
Email: meister@unm.edu

Co-Chair:
Cheng-che (Jerry) Hsu

Papers:
Mechanism for Surface Activation of Aromatic Polymers with Atmospheric Pressure Plasmas
Eleazar Gonzalez II, University of California, Los Angeles; Michael Barankin, University of California, Los Angeles; Peter C. Guschl, Surfx Technologies; Robert F. Hicks, University of California, Los Angeles
Sterilization of Surfaces with a Handheld Atmospheric Pressure Plasma
Sara B. Habib, University of California, Los Angeles; Eleazar Gonzalez II, University of California, Los Angeles; A. Tijerina, CMI; Mark Sloan, CMI; R. F. Hicks, University of California, Los Angeles
Diagnostic Study of An Arc Plasma Jet Under Atmospheric Pressure and Its Applications to Materials Processing
Cheng-che (Jerry) Hsu, National Taiwan University; Chengyi Wu, National Taiwan University; Yaowen Hsu, National Taiwan University; Yaojhen Yang, National Taiwan University
First-Principles-Based Kinetic Modeling of Surface Growth During Plasma Deposition of Silicon Thin Films
Sumeet C. Pandey, University of Massachusetts; Tejinder Singh, University of Massachusetts; Dimitrios Maroudas, University of Massachusetts
Feature Profile Evolution: From Plasma Etching and Deposition to Surface Roughness Propagation
John Hoang, UCLA; Jane P. Chang, University of California at Los Angeles
See more of this Group/Topical: Materials Engineering and Sciences Division