This preliminary program is subject to change.

Microfluidic Devices: Design, Development and Applications


Description:
Papers in this session will address advances in design, development, and applications of microfluidic devices.

Sponsor:
Ceramics


Chair:
Veera Boddu
Principal Investigator/Research Engineer
US Army Engineer Research and Development Center
Environmental Processes Branch
2902 Newmark Drive
Champaign, IL 61822
Phone Number: 217-398-5511
Fax Number: 217-373-3430
Email: veera.boddu@erdc.usace.army.mil

Co-Chair:
Govindarajan Natarajan

Papers:
39a
Rapid Formation of Chemical Gradients Combined with Cell Culture for Water Toxicity Testing
Donald M. Cropek, US Army Engineer Research and Development Center; Rachel Morgan, US Army Engineer Research and Development Center; Yanan Du, Harvard Medical School; Ali Khademhosseini, Massachusetts Institute of Technology
39b
On Chip Electrochemical Detection of Biomarkers From Cell Cultures On Microfluidic Reactors
Rebekah Wilson, University of Illinois at Urbana-Champaign; Donald M. Cropek, US Army Engineer Research and Development Center; Scott Banta, Columbia University
39c
Microfluidic Chip for Combinatorial Mixing and Screening of Assays
Benjamin R. Schudel, University of Illinois at Urbana-Champaign; Charles J. Choi, University of Illinois at Urbana-Champaign; Brian T. Cunningham, University of Illinois at Urbana-Champaign; Paul J. A. Kenis, University of Illinois at Urbana-Champaign
39d
Microfluidic Strategies to Mix Highly Viscous and/or Non-Newtonian Fluids
S.L. Perry, University of Illinois at Urbana-Champaign; J.J.L. Higdon, University of Illinois at Urbana-Champaign; P.J.A. Kenis, University of Illinois at Urbana-Champaign
39e
Microcavity Induced Acoustic Streaming Enhancement in a Surface Acoustic Wave Device Based On Langasite
Reetu Singh, University of South Florida; Subramanian K.R.S. Sankaranarayanan, Harvard University; Venkat R. Bhethanabotla, University of South Florida
39f
Endothelial Cell Culture in a Ceramic Microfluidic Device
Justin Poag, University of Kentucky; Kim Anderson, University of Kentucky; Thomas Dziubla, University of Kentucky; Richard Eitel, University of Kentucky
See more of this Group/Topical: Materials Engineering and Sciences Division