697 Plasma Science and Technology

Description:
Plasmas can be formed in vacuum, in gases, or in liquids, and are widely utilized in a variety of industries for the deposition and etching of thin films. This session will examine advances in the fundamental study and application of plasmas for electronic materials processing.

Sponsor:
Electronics and Photonics

Chair:
Selma Mededovic
Email: smededov@clarkson.edu


Papers:

12:30 PM
(697a) The Applications of Thermodynamic Approach to Select Viable Chemistry in Plasma Etching
Kun-Chieh Jack, Taeseung Kim, Vladan Jankovic and Jane P. Chang

12:55 PM
(697b) Photochemical Interaction Between Air Plasma Reactive Species and UV Photons
Matthew J. Pavlovich, David B. Graves and Douglas S. Clark

1:20 PM
(697c) Evolution of Plasma-Exposed Tungsten Surfaces Due to Helium Diffusion and Bubble Growth
Karl D. Hammond, Lin Hu, Dimitrios Maroudas and Brian D. Wirth

1:45 PM
(697d) Analysis of Drift and Diffusional Transport of Mobile Helium Clusters in Near-Surface Regions of Plasma-Exposed Tungsten
Lin Hu, Karl D. Hammond, Brian D. Wirth and Dimitrios Maroudas

2:10 PM
(697e) High Rate Deposition of Nanocrystalline Silicon By Thermal Plasma Enhanced CVD Process
Tengfei Cao, Haibao Zhang, Binhang Yan and Yi Cheng
See more of this Group/Topical: Materials Engineering and Sciences Division
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