301 Solids Handling and Processing in Particulate Systems


Description:
Papers on all aspects of solids handling, transport, storage and processing operations are included in the session scope. We welcome research investigations, industrial case histories, and papers on product applications for both dry and wet systems. In particular, we encourage submissions which consider the relationship and interaction between particle and material properties and process equipment, and product specifications and requirements. Papers addressing fundamental and phenomenological issues are also welcome.

Sponsor:
Solids Flow, Handling and Processing


Chair:
Sarah E. Mena
Postdoctoral Research Fellow
University of Michigan
Chemical Engineering
1030 Center Drive
Ann Arbor, MI
32611
Email: smena@umich.edu

Co-Chair:
Pavithra Sundararajan
Merck Sharp & Dohme
West Point, PA
19486
Email: pavithra.sundararajan@merck.com


Papers:
Understanding the Pressure Loss in Wyes for Dust Collection and Vacuum Cleaning Systems
Yi Fan, The Dow Chemical Co.; Karl Jacob, The Dow Chemical Company
Limiting Flow Rate of Fine Powders through Hoppers – Investigation of Methods to Increase the Flow Rates
Madhusudhan Kodam, The Dow Chemical Company; Karl Jacob, The Dow Chemical Company
Prediction of Loss-in-Weight Screw Feeder Performance and Quantification of Failure Modes from Attribute Measurements of Pharmaceutical Materials
Anthony Tantuccio, Merck; Kendall Moyer, Merck; David Goldfarb, Merck & Co., Inc; Sara Koynov, Merck & Co., Inc.; Stephen L. Conway, Merck & Co., Inc.; Robert Meyer, Merck
Deduster® : The Leading Dust and Streamer Removal System
Amit K. Gautam, Pelletron Corporation; William F Sahrhage III, Pelletron Corporation; Joseph Lutz, Pelletron Corporation
Improved Combustible Dust Minimum Ignition Energy (MIE) Test Method and Prediction Using CFD Simulation
Purvali Chaudhari, Texas A&M University; Bharatvaaj Ravi, Texas A&M University; Pranav Bagaria, Texas A&M University; Chad Mashuga, Texas A&M University
Abstract Submissions Closed
See more of this Group/Topical: Particle Technology Forum