594 Applications of Molecular Modeling to Study Interfacial Phenomena I


Description:

Sponsor:
Computational Molecular Science and Engineering Forum
Co-Sponsor(s):
Adsorption and Ion Exchange (02E), Thermodynamics and Transport Properties (01A), Inorganic Materials (08D)


Chair:

Cory Simon
School of Chemical, Biological, and Environmental Engineering, Oregon State University, Corvallis, OR
Co-chairs:

Kaihang Shi
Department of Chemical & Biological Engineering, Northwestern University, Evanston, IL

Yamil Colón
Department of Chemical and Biomolecular Engineering, University of Notre Dame, Mishawaka, IN

Obioma Uche
Chemical Engineering, Rochester Institute of Technology, Rochester, NY

Abstract Submissions Closed