Preliminary Program subject to change
TWB10 Granule Coating Processes
OverviewThe manufacture of granular products that include active ingredients, fillers, and excipients is common to the food, agricultural, chemical, pharmaceutical, and petrochemical industries. Granules from such operations vary in density and strength depending on the application. The coating of these engineered particles may be required for functional or cosmetic reasons. The coating application may be through a physical deposition process (spraying and evaporation of a solvent based coating solution – film coating) or may be via a reaction of the coating layer with the granule or a second phase added to the granules (such as powder layering). Papers are sought in which the mechanisms by which coatings are applied to and bind with granular materials are sought. Papers are sought in which experimental and/or modeling approaches elucidating the coating process are described.
Primary SponsorParticle Design: Formation and Processing (TWb)

Chair

Richard Turton
Chemical Engineering
West Virginia University
453 Engineering Sc. Building, P.O. Box 6102
Morgantown, WV 26506
Phone Number: 3042932111 x 2402
Fax Number: 3042934139
Email: richard.turton@mail.wvu.edu

CoChair

Greg Spontak
Research Scientist
Procter & Gamble Company
5299 Spring Grove Ave.
Cincinnati, OH 45217
Phone Number: 513-627-6075
Email: spontak.gg@pg.com
Discretization of Temperature and Moisture for Determining Surface Stickiness of Single Droplets during Drying
Stephen R. L. Werner1, Richard L. Edmonds2, Jim R. Jones2, John E. Bronlund3 and Anthony (Tony) H.J. Paterson4, (1)Institute of TEchnology and Engineering, Massey University, Tennant Drive, Palmerston North, New Zealand, (2)Institute of Technology and Engineering, Massey University, Tennant Drive, Palmerston North, New Zealand, (3)Instt. of Technology and Engineering, Massey University, Private Bag 11222, Riddet Building, Palmerston North, New Zealand, (4)Institution of Technology and Engineering, Massey University, Private Bag 11222, Palmerston North, New Zealand
The Development of New Direct Coloring Technique for Powder Coatings
Hiroyuki Tsujimoto1, Naotoshi Kinoshita1, C. C. Huang2, Akira Kondou1, Makio Naito3 and Kiyoshi Nogi3, (1)Hosokawa Powder Technology Research Institute, Osaka, Japan, (2)Hosokawa Micron Powder Systems, Summit, NJ 07901, (3)Osaka University, Osaka, Japan
Surface Modification of Silica Particles by Dry-Coating
Yamina Ouabbas1, Michel BARON2, Laurence GALET2, Alain CHAMAYOU2, Gerard THOMAS3, Phillippe GROSSEAU3 and Bernard GUILHOT3, (1)Chemical Engineering Laboratory for Particulate Solids-UMR CNRS 2392, Ecole des Mines d'ALBI, Campus Jarlard, Route de Teillet, 81000 ALBI, France, (2)Chemical Engineering Laboratory for Particulate Solids,, Ecole des Mines d'ALBI, Campus Jarlard, Route de Teillet, 81000 ALBI, France, (3)Laboratoire des Procédés en Milieux Granulaires (UMR 5148)-Centre SPIN, Ecole Nationale Superieure des Mines de Saint Etienne, 158, cours FAURIEL, 42023 Saint-Etienne Cedex 2, France
An Investigation into the Effects of Time and Shear Rate on the Spreading of Liquid Binders in a Granular Layering Process
Tyler D. Simmons1, Richard Turton1 and Paul Mort2, (1)Chemical Engineering, West Virginia University, 453 Engineering Sc. Building, P.O. Box 6102, Morgantown, WV 26506, (2)Procter & Gamble Company, Ivorydale Technical Center, Cincinnati, OH 45217
Particle Design for Improved Tabletting Characteristic Via Hot Granulation of Drug (Ibuprofen) Particles with Sublimation Tendency
Shun Urabe, Abu Bakar Noor Fitrah, Kazuo Nishii and Masayuki Horio, Graduate School of Bio-Appicationa and Systema Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Nakacho, Koganei-shi, Tokyo 185-8488, JAPAN, Tokyo, Japan
Coating and Granulation of Fine Particles in Fluidized Bed
Jun Yang1, Yuhua Chen1, Rajesh Dave1 and Robert Pfeffer2, (1)Department of Mechanical Engineering, New Jersey Institute of Technology, Newark, NJ 07102, (2)Department of Chemical Engineering, New Jersey Institute of Technology, Newark, NJ 07102

Topical W: Fifth World Congress on Particle Technology