Panel Discussion: Design for Analysis: Confronting the Challenges of Backside Power, Heterogeneous Integration, and Co-Packaged Optics in the AI Era

Wednesday, October 7, 2026: 1:30 PM-3:00 PM
Exhibit Hall - Industry Forum (Henry B. González Convention Center)

Design for Analysis: Confronting the Challenges of Backside Power, Heterogeneous Integration, and Co-Packaged Optics in the AI Era

 
Wednesday, October 7, 2026 | 1:30 – 3:00 p.m. 

An interactive session with a panel of industry experts to discuss the failure analysis challenges posed by these disruptive technologies.

Stay tuned for more information on moderators and panelists.

See more of: Technical Program
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