Thermal Spray Joining - Soldering and Filling of Aluminium Substrates under Atmospheric Conditions by a Combined Thermal Spray / Fusing Technique
Mr. Bert Drößler, Prof. Friedrich-Wilhelm Bach, Dr. Kai Möhwald and Mr. Daniel Kolar, Institute of Materials Science, Schoenebecker Allee 2, Garbsen, 30823, Germany

Thermal spraying for joining and filling of aluminium substrates at atmospheric conditions represents an enrichment in soldering. During a two-stage process rod-, wire- or cored wire type, zinc based spraying materials are applied for joining or filling areas of the substrate and get remolten afterwards. The advantages, in contrast to soldering, result from the direct application of spray material, in particular also in positions of constraint, and an uncomplicated processing, which enables a conditioned inline capability and the use as a relatively simple procedure for construction-site services. The aluminium substrate surface and spraying material passivation, which would prevent a successful remelting, can be effectively suppressed by the use of fluxing agents –either on the substrate or in cored wires– as well as a brushing activation.

Session 10: Applications & Case Studies 3

The Preliminary Program for International Thermal Spray Conference And Exposition (ITSC) (May 15-18, 2006)