Effect of Substrate SurfaceTopography and Temperature on Millimeter and Micrometer Sized Splat Formation and on Thermal Contact Resistance
Mr. Julie Cedelle1, Yatsunori Tanaka2, Michel Vardelle1 and Pierre Fauchais1, 1SPCTS Laboratory, University of Limoges, 123 av A.Thomas, 87060 LIMOGES Cedex, France, 2SPCTS Laboratory, University of Limoges, 123 av A.Thomas, 87060 Limoges Cedex, France

Many properties (thermal, electrical, mechanical…) of thermal sprayed coatings are strongly linked to the real contacts between the “piled-up” splats. The quality of contact depends on the particle impact pressure, that varies drastically with droplet (size, velocity…) and substrate parameters (temperature, topography).

Two different techniques have been developed in order to study plasma sprayed particle behaviour at impact. The first one allows direct studying under dc plasma spray conditions, while the latter one, based on the millimetre sized free falling drop, enables the visualization of flattening phenomena, but at larger scale. These two techniques bring complementary approaches and results. Results show that flattening time and cooling rate of the lamellae (metallic and ceramic) are improved with stainless steel substrate surface modification at the nanoscale and preheating over the transition temperature. Experiments of wettability show that the presence of nanopics increases the contact angle of the liquid on the substrates and reduces thermal contact resistance at interface.
Session 2: Process Diagnostics & Controls 2

The Preliminary Program for International Thermal Spray Conference And Exposition (ITSC) (May 15-18, 2006)