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Plasma Processing and Emerging Applications

Tuesday, November 18, 2008: 12:30 PM
401/402 (Marriott Philadelphia Downtown)

Description:
Plasma Processing


Sponsor:
Electronics and Photonics


Chair:
Sumit Agarwal
Email: sagarwal@mines.edu

CoChair:
Jane P. Chang
Email: jpchang@seas.ucla.edu


12:30 PM
(310a) Compositional Tuning of Bimetallic Nanoparticles for Low Temperature Carbon Nanotube Growth
Wei-Hung Chiang and R. Mohan Sankaran

12:48 PM
(310b) Design of a High Throughput Microwave Plasma Reactor for Bulk Production of Metal Oxide Nanowires
Jeong H. Kim, Vivekanand Kumar and Mahendra K. Sunkara

1:06 PM
(310c) Modeling Plasma-Surface Interactions and Their Role In Inducing Structural Transitions In Materials
Dimitrios Maroudas

1:24 PM
(310d) 3-Dimensional Monte Carlo Profile Simulation and Experimental Measurements of Surface Roughness Under Plasma Etching
Wei Guo, Hiroyo Kawai and Herbert H. Sawin

1:42 PM
(310e) Simulation of Profile Evolution In Shallow Trench Formation by Plasma Etching
John Hoang and Jane P. Chang

2:00 PM
(310f) Molecular Dynamics Simulations of Plasma-Surface Interactions: Nanoscale Feature Etching on a Silicon Substrate
Joseph J. Végh and David B. Graves

2:18 PM
(310g) Stochastic Differential Charging and Its Effects on Charging Damage and Feature Profile Evolution during Plasma Processing
Eunsu Paek and Gyeong S. Hwang

2:36 PM
(310h) Coupling Gas Phase and Surface Reaction Kinetics In C4F8 and SF6 Plasmas Used for Si and SiO2 Etching
George Kokkoris, Evangelos Gogolides, Andy Goodyear and Mike Cooke
See more of this Group/Topical: Materials Engineering and Sciences Division
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